Dossier
semiconductor independence
Coverage of semiconductor independence in the Nexus archive.
- Huawei’s new chip scaling law aims to sidestep ASML chokepoint but hurdles remain: analysts
Huawei has developed a new chip scaling law and architecture to bypass ASML's manufacturing bottleneck, aiming to achieve 1.4-nanometre node capabilities by 2031. However, analysts caution that significant manufacturing challenges remain in China's quest for semiconductor independence.