Huawei Technologies

Chinese companies are shifting from Nvidia's AI accelerators to domestic alternatives amid US-China tensions, with 46% of future budgets allocated to local products. Tencent, Alibaba, and Huawei are leading this transition, supported by a 2 trillion yuan government initiative to build AI-driven data centers using domestic technologies.

Huawei's upcoming Kirin 2026 smartphone processor uses the LogicFolding architecture to increase transistor density by 55% compared to the Kirin9030 Pro, achieving performance improvements without relying on more advanced processing nodes or lithography technology. The chip is set to power the company's next-generation Mate flagship handsets launching this autumn.

A Chinese AI chip start-up led by Wei Shaojun has exited stealth mode, focusing on 3D stacking technology to circumvent US export controls. The company, Dongfang Suanxin, launched its website and social media accounts, aligning with Huawei Technologies in advancing AI computing.

ByteDance is accelerating its shift to domestic AI chips, potentially benefiting smaller Chinese chipmakers as it seeks alternatives to Nvidia amid regulatory challenges. The company may turn to tier-two chip suppliers, including rivals to Huawei Technologies and Cambricon Technologies, for cloud infrastructure.

He Tingbo, head of Huawei Technologies' semiconductor business, re-emerged after seven years in the public eye following U.S. restrictions on Huawei's access to advanced technology in 2019. Her return symbolizes Huawei's ongoing efforts to adapt to technological challenges.

Huawei Technologies is considering deploying its newest Ascend AI chips in cloud and AI services within Latin America, as confirmed by Mark Chen, president of Huawei Cloud Latin America. This move would increase Chinese-designed hardware's presence in a region traditionally targeted by US suppliers.

China’s chip design software industry is supporting Huawei’s new chip architecture to compete with global products, but analysts caution that US rivals maintain a strong market position. Empyrean Technology, a Chinese EDA provider, has joined the effort and released a new physical verification tool called Argus.

China's chip design software firms are supporting Huawei's new architecture to produce competitive chips, but analysts caution that US rivals maintain a strong market position. Empyrean Technology, a major EDA provider, has introduced Argus, a physical verification tool aligned with this initiative.

Huawei Technologies used its Ascend 910C chips to complete post-training for the DeepSeek-V4-Pro model, advancing China's semiconductor industry's shift from AI inference to complex model training amid US sanctions.

Huawei Technologies proposes shifting semiconductor progress from focusing on transistor size to data movement speed, driven by US tech export restrictions. The article questions whether this approach is a true breakthrough or mere hype.

Chinese researchers and Huawei have developed the world's first 2D semiconductor-based parallel processor, potentially overcoming Moore’s Law limitations by using atom-thin materials like molybdenum disulfide to enable efficient electron movement.

Peking University researchers have developed a prototype 3D electronic design automation (EDA) tool to support Huawei's semiconductor development amid US trade restrictions. The tool, unveiled by the university’s School of Integrated Circuits, aims to advance cutting-edge chip design capabilities.

Huawei Technologies claims to have developed a method to produce high-end semiconductors comparable to the best worldwide, bypassing US sanctions that restrict access to advanced chipmaking equipment. The company aims to achieve 1.4-nanometer chip production by 2031, as stated by He Tingbo, president of its semiconductor business, during a conference in Shanghai.

He Tingbo, Huawei's 'chip queen,' unveiled the Tau Scaling Law in Shanghai to advance chip development amid U.S. sanctions and industry challenges. The framework aims to help Huawei compete in semiconductors despite restricted access to advanced tools and shifting industry reliance on transistor miniaturization.

Huawei Technologies unveiled a chip architectural workaround to bypass US sanctions, advancing China's semiconductor self-sufficiency. The company introduced the Tau Scaling Law, aiming for 1.4-nanometre transistor density in high-end chips by 2031, potentially altering the US-China tech rivalry.

Huawei Technologies unveiled a chip architectural workaround to bypass US sanctions, aiming to achieve 1.4-nanometre transistor density by 2031 through its Tau Scaling Law. Analysts view this as a significant step toward China's semiconductor self-sufficiency and strategic leverage in its tech rivalry with the US.

Huawei has developed a new chip scaling law and architecture to bypass ASML's manufacturing bottleneck, aiming to achieve 1.4-nanometre node capabilities by 2031. However, analysts caution that significant manufacturing challenges remain in China's quest for semiconductor independence.

Huawei has introduced a new scaling law and chip architecture, the Tau (τ) Scaling Law, aiming to achieve 1.4-nanometre process node performance without relying on advanced lithography tools. This development is part of Huawei's strategy to build a self-reliant semiconductor ecosystem.

Huawei has introduced a new scaling law and chip architecture, the Tau (τ) Scaling Law, designed to achieve 1.4-nanometre transistor performance without relying on advanced lithography tools. This development aims to bridge the gap with semiconductor leaders like TSMC and Samsung, advancing Huawei's self-reliant semiconductor ecosystem.