Skip to content
The Nexus
TECHNOLOGYMay 27 · 14:00 UTCSCMP CHINAIris Deng

Peking University unveils 3D design tool to power Huawei’s chip ambitions

Peking University researchers have developed a prototype 3D electronic design automation (EDA) tool to support Huawei's semiconductor development amid US trade restrictions. The tool, unveiled by the university’s School of Integrated Circuits, aims to advance cutting-edge chip design capabilities.

Nexus surfaces and summarizes. The full story lives at the source.

Mentioned
Spot something wrong with this article?Report a problem →
Forward this
Related Signal

Adjacent reporting