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Advanced chip packaging

Coverage of Advanced chip packaging in the Nexus archive.

Earliest in view: Apr 6 · 09:00 UTCMost recent: Jun 25 · 00:30 UTC

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BUSINESSJun 25 · 00:30 UTCSCMP WORLD
China’s JCET to build new plant in Shanghai to expand advanced chip packaging
Chinese chip-packaging and testing company Jiangsu Changjiang Electronics Technology (JCET) will invest 7.8 billion yuan (US$1.15 billion) to build a new advanced packaging and testing factory in Shanghai's Lin-gang Special Area, driven by increased demand for home-grown chips amid AI development.
TECHNOLOGYApr 6 · 09:00 UTCWIRED
The Ridiculously Nerdy Intel Bet That Could Rake in Billions
Intel is betting big on advanced chip packaging to capitalize on the AI boom.