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3.5D XDSiP

Coverage of 3.5D XDSiP in the Nexus archive.

Earliest in view: May 27 · 13:00 UTCMost recent: May 27 · 13:00 UTC
Co-mentioned in this coverage
Broadcomorganization1FuriosaAIorganization1HBM4topic1Tensor Contraction Processortopic1RNGDtopic1Nvidiaorganization1AMDorganization1
Recent coverage
  • TECHNOLOGYMay 27 · 13:00 UTCTHE REGISTER
    Broadcom's custom ASIC biz adds South Korea's FuriosaAI to its empire

    Broadcom partners with South Korean AI startup FuriosaAI to develop AI accelerators using Broadcom's advanced chip packaging technology. The collaboration aims to create a 2nm Tensor Contraction Processor with dual-layer HBM4 memory, leveraging Broadcom's 3.5D XDSiP tech to streamline multi-die chip design. FuriosaAI's RNGD chips, while less powerful than Nvidia's B200, offer significantly lower power consumption.

3.5D XDSiP · Dossier · The Nexus